WIP201610S-1R0MLDG

INPAQ Technology Co., Ltd WIP201610S-1R0MLDG

Part No:

WIP201610S-1R0MLDG

Datasheet:

-

Package:

0806 (2016 Metric)

AINNX NO:

69827767-WIP201610S-1R0MLDG

Description:

POWER INDUCTOR 2016 1.0UH 20% DC

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    0806 (2016 Metric)
  • Supplier Device Package
    0806
  • Mfr
    INPAQ Technology Co., Ltd
  • Material-Core
    Iron Powder
  • Current - Saturation (Isat)
    3.3A
  • Frequency-Self-Resonant
    90MHz
  • Inductance Frequency-Test
    1 MHz
  • Series
    WIP201610S L
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 125°C
  • Size / Dimension
    0.079" L x 0.063" W (2.00mm x 1.60mm)
  • Tolerance
    ±20%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Wirewound
  • Current Rating (Amps)
    3 A
  • Shielding
    Shielded
  • Inductance
    1 µH
  • DC Resistance (DCR)
    60mOhm Max
  • Height Seated (Max)
    0.039" (1.00mm)
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