Infineon Technologies TUA6034TCUMA1

Mounting Type

Surface Mount

Package / Case

38-TFSOP (0.173, 4.40mm Width)

Supplier Device Package

P-TSSOP-38

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Type

Tuner

Applications

NTSC, PAL

Base Part Number

TUA6034