Infineon Technologies TLE8262-2E

Mounting Type

Surface Mount

Package / Case

36-BSSOP (0.295, 7.50mm Width) Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

36

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2008

JESD-609 Code

e3

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

36

Type

Transceiver

Terminal Finish

MATTE TIN

Applications

Automotive

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

IT ALSO OPERATES AT 3 TO 40V

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Supply Voltage

13.5V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

TLE8262

Pin Count

a count of all of the component leads (or pins)

36

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

28V

Supply Voltage-Min (Vsup)

3V

Quiescent Current

The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

28μA

Halogen Free

Halogen Free

Length

12.8mm

Height Seated (Max)

2.55mm

Width

7.6mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant