S25HS512TDPBHI013

Infineon Technologies S25HS512TDPBHI013

Part No:

S25HS512TDPBHI013

Datasheet:

Package:

24-VBGA

AINNX NO:

31253783-S25HS512TDPBHI013

Category:

Memory

Description:

NOR Flash Nor

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    24-VBGA
  • Supplier Device Package
    24-FBGA (6x8)
  • RoHS
    Details
  • Supply Voltage-Min
    1.7 V
  • Interface Type
    Quad SPI
  • Timing Type
    Synchronous
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    2500
  • Package
    Tape & Reel (TR)
  • Mfr
    Infineon Technologies
  • Product Status
    Active
  • Memory Types
    Non-Volatile
  • Supply Voltage-Max
    2 V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Series
    Semper™
  • Technology
    FLASH - NOR (SLC)
  • Voltage - Supply
    1.7V ~ 2V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512Mbit
  • Clock Frequency
    133 MHz
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Quad I/O, QPI
  • Write Cycle Time - Word, Page
    -
  • Memory Organization
    64M x 8
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