S25HL01GTDPMHB013

Infineon Technologies S25HL01GTDPMHB013

Part No:

S25HL01GTDPMHB013

Datasheet:

Package:

16-SOIC (0.295, 7.50mm Width)

AINNX NO:

31254039-S25HL01GTDPMHB013

Category:

Memory

Description:

NOR Flash Nor

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.295, 7.50mm Width)
  • Supplier Device Package
    16-SOIC
  • RoHS
    Details
  • Supply Voltage-Min
    2.7 V
  • Interface Type
    Quad SPI
  • Timing Type
    Synchronous
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    1450
  • Package
    Tape & Reel (TR)
  • Mfr
    Infineon Technologies
  • Product Status
    Active
  • Memory Types
    Non-Volatile
  • Supply Voltage-Max
    3.6 V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C (TA)
  • Series
    Semper™
  • Technology
    FLASH - NOR (SLC)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1Gbit
  • Clock Frequency
    133 MHz
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Quad I/O, QPI
  • Write Cycle Time - Word, Page
    -
  • Memory Organization
    128M x 8
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