MINICONTROL2GOTOBO1

Infineon Technologies MINICONTROL2GOTOBO1

Part No:

MINICONTROL2GOTOBO1

Datasheet:

-

Package:

-

AINNX NO:

30876072-MINICONTROL2GOTOBO1

Description:

Magnetic Sensor Development Tools

Products specifications
  • RoHS
    N
  • Tool Is For Evaluation Of
    MINI_CONTROL2GO
  • Part # Aliases
    MINI_CONTROL2GO SP005350192
  • For Use With
    3D Magnetic Sensor 2GO Kits, 3D Magnetic Sensor Shield2Go
  • Package
    Bulk
  • Mfr
    Infineon Technologies
  • Product Status
    Active
  • For Use With/Related Products
    2GO, Shield2Go
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    XENSIV™
  • Type
    3D Magnetic Sensor
  • Note
    -
  • Accessory Type
    HMI Mini Control With 4 Directions And 360° Rotation
  • Product
    Evaluation Boards
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