KITXMCLINKSEGGERV1TOBO1

Infineon Technologies KITXMCLINKSEGGERV1TOBO1

Part No:

KITXMCLINKSEGGERV1TOBO1

Datasheet:

XMC? Link Brief

Package:

-

ROHS:

AINNX NO:

7749670-KITXMCLINKSEGGERV1TOBO1

Description:

ISOLATED DEBUG PROBE FOR XMC WIT

Products specifications
  • Factory Lead Time
    25 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Published
    2016
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Debugger
  • Core Architecture
    ARM
  • Contents
    Board(s)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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