IRPLDIM4E

Infineon Technologies IRPLDIM4E

Part No:

IRPLDIM4E

Datasheet:

IRPLDIM4E

Package:

-

AINNX NO:

8171090-IRPLDIM4E

Description:

KIT DES BALLAST 26W IRS2530D

Products specifications
  • Factory Lead Time
    8 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Opto/Lighting
  • Function
    Ballast Control
  • Utilized IC / Part
    IRS2530D
  • Supplied Contents
    Board(s)
  • Evaluation Kit
    Yes
  • Primary Attributes
    26W, Dimmable, 220 VAC
  • Embedded
    No
  • Secondary Attributes
    Filament Preheat, Auto-Reset, Open Filament, No-Lamp, Brownout Protection
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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