Infineon Technologies IM67D130AXTSA2

Shape

Rectangular

Qualification

AEC-Q103

Series

XENSIV?

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

0.157" L x 0.118" W (4.00mm x 3.00mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Solder Pads

Type

MEMS (Silicon)

Output Type

Digital, PDM

Current - Supply

980 μA

Direction

Noise Cancelling

Voltage Range

1.62 V ~ 3.6 V

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

20 kHz ~ 20 kHz

Sensitivity

-36dB ±1dB @ 94dB SPL

Port Location

Bottom

S/N Ratio

67dB

Grade

Automotive

Height (Max)

0.051" (1.30mm)