Infineon Technologies BGSC2341ML10E6327XTSA1

Mounting Type

Surface Mount

Package / Case

10-XFLGA

Supplier Device Package

PG-TSLP-10-2

Mfr

Infineon Technologies

Product Status

Active

Dimensions

1.1 x 1.5mm

Package Type

TSLP-10-2

MSL

MSL 1 - Unlimited

Switch Configuration

SPDT

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

7500

Mounting Styles

SMD/SMT

Part # Aliases

BGSC 2341ML10 E6327 SP003086540

Manufacturer

Infineon

Brand

Infineon Technologies

RoHS

Details

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Subcategory

Wireless & RF Integrated Circuits

Technology

Si

Frequency

400MHz ~ 3.8GHz

Pin Count

a count of all of the component leads (or pins)

10

Function

Digitally Tunable Capacitor, SPDT

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

RF Switch ICs

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

General Purpose

Secondary Attributes

MIPI Interface

Product Category

a particular group of related products.

RF Switch ICs