BGM681L11E6327XT

Infineon Technologies BGM681L11E6327XT

Part No:

BGM681L11E6327XT

Datasheet:

BGM681L11

Package:

10-UFDFN Exposed Pad

ROHS:

AINNX NO:

1879501-BGM681L11E6327XT

Description:

IC GPS FRONT-END 3.6V TSLP11-1

Products specifications
  • Package / Case
    10-UFDFN Exposed Pad
  • Supplier Device Package
    TSLP-11
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Frequency
    1575MHz
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    GPS
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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