Infineon Technologies BGF 100 E6327

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Package / Case

11-WFBGA, WLCSP

Mounting Type

Surface Mount

Diode Element Material

SILICON

Operating Temperature (Min.)

-40°C

Operating Temperature (Max.)

85°C

Number of Elements

1

Published

2005

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

11

ECCN Code

EAR99

Applications

Audio Systems

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.50

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

BGF100

JESD-30 Code

R-XBGA-B11

Function

Volume Control

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Number of Channels

2

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Specifications

a measure of a material's ability to?conduct heat.?

6GHz

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant