TPM9673FW2610RPIEBTOBO1

Infineon TPM9673FW2610RPIEBTOBO1

Part No:

TPM9673FW2610RPIEBTOBO1

Manufacturer:

Infineon

Datasheet:

Package:

-

AINNX NO:

47098729-TPM9673FW2610RPIEBTOBO1

Category:

Accessories

Description:

OPTIGA TPM 9673 RPI EVAL

Products specifications
  • Package
    Bulk
  • Mfr
    Infineon Technologies
  • Product Status
    Active
  • Part # Aliases
    TPM 9673 FW26.10 RPI EB SP005750438
  • Manufacturer
    Infineon
  • Brand
    Infineon Technologies
  • Series
    OPTIGA™ TPM
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Interface
  • Subcategory
    Embedded Solutions
  • Function
    Trusted Platform Module (TPM)
  • Utilized IC / Part
    SLB 9673
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Daughter Cards & OEM Boards
  • Contents
    Board(s)
  • Platform
    Raspberry Pi
  • Product Category

    a particular group of related products.

    Daughter Cards & OEM Boards
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Documents & Media Download datasheets and manufacturer documentation for Infineon TPM9673FW2610RPIEBTOBO1.
  • Datasheets :