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T2563NH75TOHXOSA1

Infineon T2563NH75TOHXOSA1

Part No:

T2563NH75TOHXOSA1

Manufacturer:

Infineon

Datasheet:

Package:

-

AINNX NO:

32011775-T2563NH75TOHXOSA1

Description:

Products specifications
  • Supplier Package
    T17240L-1
  • PCB changed
    3
  • Package Height
    40.4
  • PPAP
    No
  • Automotive
    No
  • EU RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Diameter
    172.5
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