Infineon S70KS1282GABHV023

Mounting Type

Surface Mount

Package / Case

24-VBGA

Supplier Device Package

PG-BGA-24-801

Material

Metal

Pitch thread

1.5

Surface protection

Nickel-plated

Glass-fibre reinforced

No

Thread length

8

Degree of protection (IP)

IP54

Explosion-tested version

No

Suitable for cable diameter

12 - 15

With locknut

No

Thread type

Metric

With strain relief

Yes

Nominal thread size metric/PG

32

Wrench width

35

Material quality

Brass

Bend radius protection/trumpet flare

No

Shock resistant

Yes

Model

Straight

Package

Tape & Reel (TR)

Mfr

Infineon Technologies

Product Status

Active

Memory Types

Volatile

Moisture Sensitive

Yes

Factory Pack QuantityFactory Pack Quantity

2500

Manufacturer

Infineon

Brand

Infineon Technologies

RoHS

Details

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 105°C (TA)

Series

HyperRAM™ KS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Subcategory

Memory & Data Storage

Technology

PSRAM (Pseudo SRAM)

Voltage - Supply

1.7V ~ 2V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

128Mbit

Clock Frequency

200 MHz

Access Time

35 ns

Memory Format

PSRAM

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

HyperBus

Write Cycle Time - Word, Page

35ns

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

DRAM

Product Category

a particular group of related products.

DRAM

Memory Organization

16M x 8