Infineon IRF7313TRPBF-1

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

8-SOIC

Transistor Element Material

SILICON

Package

Tape & Reel (TR)

Current - Continuous Drain (Id) @ 25℃

6.5A (Ta)

Mfr

Infineon Technologies

Product Status

Obsolete

Moisture Sensitivity Levels

1

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

Yes

Manufacturer Part Number

IRF7313TRPBF-1

Manufacturer

Infineon Technologies AG

Number of Elements

2

Part Life Cycle Code

End Of Life

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Risk Rank

5.31

Drain Current-Max (ID)

6.5 A

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 150°C (TJ)

Series

HEXFET®

ECCN Code

EAR99

Subcategory

FET General Purpose Power

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Power - Max

2W (Ta)

FET Type

2 N-Channel (Dual)

Rds On (Max) @ Id, Vgs

29mOhm @ 5.8A, 10V

Vgs(th) (Max) @ Id

1V @ 250µA

Input Capacitance (Ciss) (Max) @ Vds

650pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

33nC @ 10V

Drain to Source Voltage (Vdss)

30V

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

MS-012AA

Drain Current-Max (Abs) (ID)

6.5 A

Drain-source On Resistance-Max

0.029 Ω

DS Breakdown Voltage-Min

30 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

2 W

FET Feature

Standard