CYF2072V33L-100BGXI

Infineon CYF2072V33L-100BGXI

Part No:

CYF2072V33L-100BGXI

Manufacturer:

Infineon

Datasheet:

Package:

68-VFQFN Exposed Pad

AINNX NO:

36751640-CYF2072V33L-100BGXI

Description:

FIFO Mem Sync Dual Width Uni-Dir 2M x 36 209-Pin FBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    68-VFQFN Exposed Pad
  • Supplier Device Package
    68-QFN (8x8)
  • Number of I/Os
    36
  • Package
    Tape & Reel (TR)
  • Base Product Number
    CY8C5467
  • Mfr
    Infineon Technologies
  • Data Converters
    A/D 2x12b; D/A 4x8b
  • Product Status
    Active
  • Maximum Clock Rate
    100 MHz
  • Supplier Package
    FBGA
  • Typical Operating Supply Voltage
    3.3000 V
  • Minimum Operating Supply Voltage
    3 V
  • Timing Type
    Synchronous
  • Expansion Support
    Yes
  • Maximum Operating Supply Voltage
    3.6 V
  • Mounting
    Surface Mount
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Series
    PSOC® 5 CY8C54
  • Voltage - Supply
    3 V ~ 3.6 V
  • Pin Count

    a count of all of the component leads (or pins)

    209
  • Function
    Synchronous
  • Current - Supply (Max)
    -
  • Configuration
    Dual
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    72M (2M x 36)
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    67MHz
  • RAM Size
    32K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    CapSense, DMA, LCD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Single-Core
  • Program Memory Size
    128KB (128K x 8)
  • Connectivity
    I²C, LINbus, SPI, UART/USART, USB
  • Access Time
    10ns
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    100MHz
  • Data Bus Width
    36 Bit
  • Organization
    2Mx36
  • Density
    72 Mbit
  • EEPROM Size
    2K x 8
  • Screening Level
    Industrial
  • Bus Directional
    Uni-Directional
  • Retransmit Capability
    Yes
  • FWFT Support
    No
  • Programmable Flags Support
    Yes
  • Expansion Type
    Width
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