BSP75A-E6327

Infineon BSP75A-E6327

Part No:

BSP75A-E6327

Manufacturer:

Infineon

Datasheet:

-

Package:

-

AINNX NO:

31948404-BSP75A-E6327

Description:

Products specifications
  • EU RoHS
    Supplier Unconfirmed
  • ECCN (US)
    EAR99
  • HTS
    8542.39.00.01
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Mounting
    Surface Mount
  • Package Height
    1.6
  • Package Width
    3.5
  • Package Length
    6.5
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    SOT
  • Supplier Package
    SOT-223
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    4
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