Infineon BAS21UE6327T

Material

Si

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.80

Automotive

Yes

PPAP

Unknown

Maximum DC Reverse Voltage (V)

200

Peak Reverse Repetitive Voltage (V)

250

Maximum Continuous Forward Current (A)

0.25

Peak Non-Repetitive Surge Current (A)

4

Peak Forward Voltage (V)

Peak Reverse Current (uA)

0.1

Maximum Diode Capacitance (pF)

5

Maximum Power Dissipation (mW)

250

Peak Reverse Recovery Time (ns)

50

Minimum Operating Temperature (°C)

-65

Maximum Operating Temperature (°C)

150

Supplier Temperature Grade

Automotive

Mounting

Surface Mount

Package Height

1(Max)

Package Width

1.6

Package Length

2.9

PCB changed

6

Standard Package Name

SOT-23

Supplier Package

SC-74

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Type

Switching Diode

Pin Count

a count of all of the component leads (or pins)

6

Configuration

Triple Parallel