Infineon BAR9502LSE6327XT

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.70

Automotive

No

PPAP

No

Maximum Reverse Voltage (V)

50

Maximum Forward Current (mA)

100

Maximum Forward Voltage (V)

1.2

Maximum Series Resistance @ Maximum IF (Ohm)

1.5@10mA

Maximum Series Resistance @ Minimum IF (Ohm)

3.5(Typ)@1mA

Maximum Diode Capacitance (pF)

0.35@1V

Maximum Power Dissipation (mW)

150

Typical Carrier Life Time (us)

0.5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

0.27(Max)

Package Width

0.32

Package Length

0.62

PCB changed

2

Standard Package Name

TSSLP

Supplier Package

TSSLP

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Switch

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

UHF