Inchange Semiconductor Company Ltd 2SB1064

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Material

polyolefin

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Type of capacitor

ceramic

Kind of capacitor

MLCC

Mounting

SMD

Case - inch

0805

Case - mm

2012

Capacitors series

KGM

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

INCHANGE SEMICONDUCTOR CO LTD

Package Description

FLANGE MOUNT, R-PSFM-T3

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Transition Frequency-Nom (fT)

70 MHz

Weight gross

1465.00

Diameter before shrinkage

6 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

supplied in rolls of 100 m

ECCN Code

EAR99

Type

Heat shrink tube with adhesive layer, shrinkage 4:1

Color

black

Capacitance

3.9pF

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Reach Compliance Code

unknown

JESD-30 Code

R-PSFM-T3

Dielectric

C0G (NP0)

Configuration

SINGLE

Transistor Application

AMPLIFIER

Polarity/Channel Type

PNP

JEDEC-95 Code

TO-220AB

Power Dissipation-Max (Abs)

30 W

Collector Current-Max (IC)

3 A

DC Current Gain-Min (hFE)

60

Collector-Emitter Voltage-Max

50 V

VCEsat-Max

1 V

Collector-Base Capacitance-Max

50 pF

Length

100000 mm