IDT 5P49V5923A505NLGI8

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Mounting Type

Surface Mount

Package / Case

24-VFQFN Exposed Pad

Supplier Device Package

24-QFN (4x4)

Diode Element Material

SILICON

Number of Terminals

2

Breakdown Voltage-Nom

440

Number of Elements

1

Package Shape

ROUND

Power Dissipation (Max)

1

Package Body Material

UNSPECIFIED

Package Style

LONG FORM

Series

VersaClock® 5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL RECOGNIZED

Technology

AVALANCHE

Terminal Position

AXIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

O-XALF-W2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

BIDIRECTIONAL

Configuration

SINGLE

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Case Connection

ISOLATED

Rep Pk Reverse Voltage-Max

376

JEDEC-95 Code

DO-41

Non-rep Peak Rev Power Dis-Max

400

Breakdown Voltage-Min

418

Clamping Voltage-Max

600

Breakdown Voltage-Max

462