HSIB804-BGA
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31326763-HSIB804-BGA
Heat Sinks PC104+ Heatsink FOR IB805
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
RM-N8 HEATSINK
iBASE TechnologyHeat Sinks HEATSINK;RM-N8HSIB952-A
iBASE TechnologyHeat Sinks Heatsink +Fan for IB952F-2718, (RoHS), H052HSIB952A0000APEMBX-IB897-HS-2
iBASE TechnologyHeat Sinks Heat Spreader FOR IB897 (BGA)# HSIB897-BGA-1EMBX-IB905-SPR
iBASE TechnologyHeat Sinks Heat Spreader FOR IB905 # HSIB905-PGA-1HSET875-X
iBASE TechnologyHeat Sinks HEAT SPREADER;HSET875-X V-AHSIB919-1
iBASE TechnologyHeat Sinks AC, Heat Spreader for IB919 series, (RoHS) , H051xxxxxxxxHSIB956-A
iBASE TechnologyHeat Sinks AC, Heatsink + Fan for IB956 series, (RoHS) , H052HSIB956A0000APHSIB952-B
iBASE TechnologyHeat Sinks Heatsink +Fan for IB952F-2748, (RoHS), H052HSIB952B0000APHBIB953-A
iBASE TechnologyHeat Sinks Heatsink + FAN for IB953 (RoHS)EMBX-IB908-HS-2
iBASE TechnologyHeat Sinks Heat Spreader FOR IB908/IB909 (BGA)# HSIB908-BGA-2