ET975S-I5

iBASE Technology ET975S-I5

Part No:

ET975S-I5

Manufacturer:

iBASE Technology

Datasheet:

-

Package:

Axial

AINNX NO:

35689105-ET975S-I5

Description:

Computer-On-Modules - COM Intel U-series COM Express i7-7600U

Products specifications
  • Package / Case
    Axial
  • Supplier Device Package
    Axial
  • Processor Brand
    Intel
  • Maximum RAM Capacity
    32 GB
  • Processor Series
    Intel Core i5-7600U
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 60 C
  • Minimum Operating Temperature
    0 C
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    IBASE
  • Brand
    IBASE
  • Installed RAM
    0 GB
  • Processor Type
    Core i5-7600U
  • RoHS
    Details
  • Memory Types
    DDR4
  • Dimensions
    95 mm x 95 mm
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -65°C ~ 175°C
  • Series
    Military, MIL-PRF-55182/01, RNC55
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Size / Dimension
    0.094 Dia x 0.250 L (2.39mm x 6.35mm)
  • Tolerance
    ±0.1%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±25ppm/°C
  • Resistance
    33.6 Ohms
  • Composition
    Metal Film
  • Power (Watts)
    0.125W, 1/8W
  • Subcategory
    Computing
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    S (0.001%)
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32 GB
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Computer-On-Modules - COM
  • Form Factor

    an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging

    COM Express Type 6
  • Features
    Military, Moisture Resistant, Weldable
  • Product Category

    a particular group of related products.

    Computer-On-Modules - COM
  • Height Seated (Max)
    --
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