Hynix HYD0SFE0AF1P-6SH0E

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

149

Manufacturer Part Number

HYD0SFE0AF1P-6SH0E

Part Life Cycle Code

Active

Ihs Manufacturer

SK HYNIX INC

Package Description

FBGA-149

Risk Rank

5.67

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

IT ALSO CONTAINS 256MBIT (16MX16BIT) MOBILE DDR SDRAM

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B149

Supply Voltage-Max (Vsup)

1.95 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

1.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

32MX16

Seated Height-Max

1.4 mm

Memory Width

16

Memory Density

536870912 bit

Memory IC Type

MEMORY CIRCUIT

Length

14 mm

Width

10 mm