HY27UF082G2B-FPCB

Hynix HY27UF082G2B-FPCB

Part No:

HY27UF082G2B-FPCB

Manufacturer:

Hynix

Datasheet:

-

Package:

-

AINNX NO:

23867394-HY27UF082G2B-FPCB

Category:

Unclassified

Description:

Flash, 256MX8, 20ns, PBGA63,

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    63
  • Package Description
    FBGA, BGA63,10X12,32
  • Package Style
    GRID ARRAY, FINE PITCH
  • Moisture Sensitivity Levels
    1
  • Number of Words Code
    256000000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA63,10X12,32
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    20 ns
  • Operating Temperature-Max
    70 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    HY27UF082G2B-FPCB
  • Number of Words
    268435456 words
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Manufacturer
    SK Hynix Inc
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    SK HYNIX INC
  • Risk Rank
    5.81
  • JESD-609 Code
    e3
  • Pbfree Code
    Yes
  • Type
    SLC NAND TYPE
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    Flash Memories
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B63
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3/3.3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Current-Max
    0.03 mA
  • Organization
    256MX8
  • Memory Width
    8
  • Standby Current-Max
    0.00005 A
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3.3 V
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    2K
  • Sector Size
    128K
  • Page Size
    2K words
  • Ready/Busy
    YES
0 Similar Products Remaining