Honeywell Sensing and Productivity Solutions ABP2-BREAKOUT-BRD

Mfr

Honeywell Sensing and Productivity Solutions

Package

Box

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

21

Manufacturer

Honeywell

Brand

Honeywell

RoHS

Details

Series

ABP2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Case

Type

Connectivity

Subcategory

Development Tools

Function

Breakout Board

Note

-

Utilized IC / Part

ABP2

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Pressure Sensor Development Tools

Contents

Board(s)

Platform

-

Interconnect System

-

Suggested Programming Environment

-

Product Category

a particular group of related products.

Pressure Sensor Development Tools