Honeywell Aerospace HTNFET-DC

Factory Lead Time

8 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

8-CDIP Exposed Pad

Drive Voltage (Max Rds On, Min Rds On)

5V

Power Dissipation (Max)

50W Tj

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

HTMOS™

Published

2004

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

400m Ω @ 100mA, 5V

Vgs(th) (Max) @ Id

2.4V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds

290pF @ 28V

Gate Charge (Qg) (Max) @ Vgs

4.3nC @ 5V

Drain to Source Voltage (Vdss)

55V

Vgs (Max)

10V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant