HTEE25608D

Honeywell Aerospace HTEE25608D

Part No:

HTEE25608D

Manufacturer:

Honeywell Aerospace

Package:

56-BCPGA

ROHS:

AINNX NO:

1745714-HTEE25608D

Category:

Memory

Description:

IC EEPROM 256KBIT PARA/SPI 56PGA

Products specifications
  • Factory Lead Time
    19 Weeks
  • Mounting Type
    Through Hole
  • Package / Case
    56-BCPGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Pins
    56
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~225°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2013
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    56
  • Voltage - Supply
    4.75V~5.25V
  • Terminal Position
    PERPENDICULAR
  • Number of Functions
    1
  • Supply Voltage
    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Supply Voltage-Max (Vsup)
    5.25V
  • Supply Voltage-Min (Vsup)
    4.75V
  • Interface
    Parallel, Serial
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Kb 32K x 8
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Clock Frequency
    5MHz
  • Access Time
    150ns
  • Memory Format
    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel, SPI
  • Organization
    32KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    90ms
  • Memory Density
    262144 bit
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    5V
  • Length
    38.1mm
  • Height Seated (Max)
    6.8mm
  • Width
    19.05mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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