Honeywell CMC25.3

Lifecycle Status

Production (Last Updated: 6 days ago)

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Lead, Tin

Mount

Free Hanging

Inside Diameter

13.08 mm

Contact Materials

Copper

RoHS

Non-Compliant

Insulation Materials

PVDF

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

5 %

Termination

Circular

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

90 ppm/°C

Resistance

300 mΩ

Composition

Wirewound

Color

Yellow

Power Rating

25 W

Depth

27.43 mm

Military Standard

MIL-PRF-18546

ELV

Non-Compliant

Plating

Lead, Tin

Sealable

No

Insulation Diameter

13.081 mm

Insulation

Insulated

Insulated Wire Support

Yes

Heavy Duty

No

Stud Diameter

13.08 mm

Government Qualified

No

Number of Holes

1

Stud Size

M12

Length

51.1556 mm

Plating Thickness

2.54 µm

Thickness

1.2192 mm

Material Thickness

A measure of the distance between two surfaces of an object

1.2192 mm

Tongue Thickness

1.22 mm

Lead Free

Not Applicable