Hirose Electric Co Ltd DF3-TA22HC

Factory Lead Time

16 Weeks

Mount

Wire

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

DF3

Published

2001

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Black

Connector Support Type

TOOL AND MACHINERY

Wire Gauge or Range - AWG

22 AWG

Tool Type

Hand Crimper

Tool Method

Manual

Ratcheting

No Ratchet

Wire Entry Location

Side Entry

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Not Applicable