Hirose FX23-40P-0.5SV20B(20)

Number of Terminals

6

Package Style

MICROELECTRONIC ASSEMBLY

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

MODULE,6LEAD,0.8

Operating Temperature-Min

-40

Operating Temperature-Max

85

Input Voltage-Max

75

Input Voltage-Min

36

Output Voltage-Nom

15

Factory Pack QuantityFactory Pack Quantity

150

Part # Aliases

573-3109-0-20

Manufacturer

Hirose Electric

Brand

Hirose Connector

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Subcategory

Board to Board & Mezzanine Connectors

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Output Current-Max

.667

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Board to Board & Mezzanine Connectors

Product Category

a particular group of related products.

Board to Board & Mezzanine Connectors