EF2-D60-EP1

Hirose EF2-D60-EP1

Part No:

EF2-D60-EP1

Manufacturer:

Hirose

Datasheet:

-

Package:

QFN

AINNX NO:

36820462-EF2-D60-EP1

Category:

Accessories

Description:

CONN END PLATE

Products specifications
  • Package / Case
    QFN
  • Product Depth (mm)
    5(mm)
  • Operating Temp Range
    -40C to 85C
  • Mounting Styles
    Surface Mount
  • Package
    Bag
  • Mfr
    Hirose Electric Co Ltd
  • Product Status
    Active
  • For Use With/Related Products
    ZERO SCREW™ EF2 Series
  • Usage Level
    Industrial grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    ZERO SCREW™ EF2
  • Type
    End Plate
  • Number of Positions
    -
  • Color
    Black
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • Screening Level
    Industrial
  • Product Length (mm)
    7(mm)
  • Product Height (mm)
    0.9(mm)
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