HEYCO PRODUCTS 1201

Package / Case

QFN

Material

Polyamide (PA66), Nylon 6/6

Product Depth (mm)

3.2(mm)

Operating Temp Range

-40C to 105C

Mounting Styles

Surface Mount

Harmonized Code

ECCN

EAR99

Itar Registered

Unavailable

Unit Weight

1 oz

Factory Pack QuantityFactory Pack Quantity

6500

Manufacturer

Heyco

Brand

Heyco

RoHS

Details

Package

Box

Mfr

Heyco Products Corporation

Product Status

Active

For Use With/Related Products

SJ, SJO, SJT

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Original Strain Relief Bushings

Color

White

Subcategory

Wire & Cable Management

Pin Count

a count of all of the component leads (or pins)

4

Panel Cutout Dimensions

Variable Size

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Strain Reliefs

Screening Level

Industrial

Bushing, Grommet Type

Bushing, Strain Relief

Product

Strain Reliefs

Features

-

Product Category

a particular group of related products.

Cable Glands, Strain Reliefs & Cord Grips

Product Length (mm)

5(mm)

Length

14.7 mm

Diameter - Inside

Variable Size

Panel Thickness

0.062 (1.57mm)

Product Height (mm)

0.75(mm)

Material Flammability Rating

UL94 V-2