177-1-J
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33731750-177-1-J
Bottle Shape W/rib Vg Style
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
416-13054 1613-1-B5W2-PO-X-BK
HellermannTytonHellermannTyton End Cap Black, Polyolefin Cross Linked (POX) Adhesive Lined, 20mm402-23058 223-2-B8W-PO-X-BK
HellermannTytonHellermannTyton Y Joint Black, Polyolefin Cross Linked (POX) Adhesive Lined, 33mm416-14047 1614-1-B5W2-PO-X-BK
HellermannTytonHellermannTyton End Cap Black, Polyolefin Cross Linked (POX) Adhesive Lined, 40mm422-50101
HellermannTytonHellermannTyton 422-50101 Premolded heatshrink 1 pc(s)402-06185
HellermannTytonHellermannTyton 402-06185 Premolded heatshrink 1 pc(s)401-58880
HellermannTytonHellermannTyton 401-58880 Premolded heatshrink 1 pc(s)104-4-G
HellermannTytonHS SERIES BOTTLE SHAPED BOOTHE300
HellermannTytonHE30012273147-130
HellermannTytonHeat Shrink Cable Boots & End Caps12273148-320
HellermannTytonHeat Shrink Cable Boots & End Caps