Harwin Inc. S8091-46R

Factory Lead Time

13 Weeks

Mount

Solder

Mounting Type

Solder

Material

Phosphor Bronze, Tin Plated

Body Material

Bronze

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

EZ BoardWare

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Clip, C-Type

Color

Silver

Depth

4.4mm

Plating

Tin

Type Attributes

Elongated, Split

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

900 μm

Opening Size

0.098L x 0.028 H 2.50mmx0.70mm

Features

Corrosion Resistant

Height

0.053 1.35mm

Length

0.197 5.00mm

Width

0.157 4.00mm

Material Thickness

A measure of the distance between two surfaces of an object

0.008 0.20mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant