Harris Semiconductor IRFP450

Mounting Type

Surface Mount

Package / Case

2-PLCC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Supplier Device Package

2-PLCC

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Mfr

Dialight

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Drain Current-Max (ID)

14 A

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Turn-off Time-Max (toff)

160 ns

Turn-on Time-Max (ton)

93 ns

Current consumption

20 mA

Rise/fall time

5 ns

Series

597

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

3.20mm L x 2.80mm W

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Type

Quartz generator HCMOS/ TTL

Terminal Finish

TIN LEAD

Color

White

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.29.00.95

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Depth

20.4 mm

Reach Compliance Code

unknown

Frequency

16000 MHz

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Voltage - Forward (Vf) (Typ)

3.1V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

131°

Case Connection

DRAIN

Current - Test

10mA

Lens Style

Round with Flat Top

Transistor Application

SWITCHING

Lens Size

2.29mm Dia

Polarity/Channel Type

N-CHANNEL

Millicandela Rating

135mcd

JEDEC-95 Code

TO-247

Drain-source On Resistance-Max

0.4 Ω

Pulsed Drain Current-Max (IDM)

56 A

DS Breakdown Voltage-Min

500 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

180 W

Housing

DIL14

Power Dissipation Ambient-Max

180 W

Height

5.4 mm

Width

12.8 mm

Height (Max)

2.15mm