Mounting Type
Through Hole
Package / Case
TO-204AE
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Supplier Device Package
TO-204AE
Diode Element Material
SILICON
Number of Terminals
2
Mfr
Harris Corporation
Package
Bulk
Product Status
Active
RoHS
Non-Compliant
Package Description
O-LALF-W2
Package Style
LONG FORM
Moisture Sensitivity Levels
NOT SPECIFIED
Package Body Material
GLASS
Reflow Temperature-Max (s)
NOT SPECIFIED
Rohs Code
No
Manufacturer Part Number
GE1003
Package Shape
ROUND
Manufacturer
Rochester Electronics LLC
Number of Elements
1
Part Life Cycle Code
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
Risk Rank
5.83
Series
-
JESD-609 Code
e0
Pbfree Code
No
Terminal Finish
TIN LEAD
Terminal Position
AXIAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
unknown
JESD-30 Code
O-LALF-W2
Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL
Configuration
SINGLE
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Type
Standard
Current - Reverse Leakage @ Vr
2 μA @ 150 V
Voltage - Forward (Vf) (Max) @ If
950 mV @ 1 A
Case Connection
ISOLATED
Operating Temperature - Junction
-65°C ~ 175°C
Output Current-Max
1 A
Voltage - DC Reverse (Vr) (Max)
150 V
Current - Average Rectified (Io)
1A
Rep Pk Reverse Voltage-Max
150 V
Capacitance @ Vr, F
45pF @ 4V, 1MHz
Reverse Recovery Time-Max
0.035 µs
Reverse Recovery Time (trr)
35 ns