HALO TGR21-MX2V8LF

Mounting Type

Through Hole

Package / Case

DO-201AE, Axial

Supplier Device Package

DO-201AE

Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Base Part Number

EGP30D

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 200V

Voltage - Forward (Vf) (Max) @ If

1V @ 3A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

200V

Current - Average Rectified (Io)

3A

Capacitance @ Vr, F

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Reverse Recovery Time (trr)

50ns