GLF1123H

GLF Integrated Power GLF1123H

Part No:

GLF1123H

Datasheet:

-

Package:

4-XFBGA, WLCSP

AINNX NO:

68831954-GLF1123H

Description:

Nano-Current Consumed Power Swit

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    4-XFBGA, WLCSP
  • Supplier Device Package
    4-WLCSP (0.67x0.67)
  • Mfr
    GLF Integrated Power
  • Series
    IQSmart?
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Outputs
    1
  • Output Type
    P-Channel
  • Interface
    On/Off
  • Current - Output (Max)
    1A
  • Output Configuration
    High Side
  • Voltage - Supply (Vcc/Vdd)
    Not Required
  • Input Type
    Non-Inverting
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    General Purpose
  • Ratio - Input:Output
    1:1
  • Voltage - Load
    1.1V ~ 5.5V
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Current Limiting (Fixed)
  • Rds On (Typ)
    52mOhm
  • Features
    Load Discharge, Slew Rate Controlled
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