Glenair 340FS001NF10-6N-88

Housing Material

Aluminium

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

5 %

Termination

Axial

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Resistance

11 Ω

Composition

Wirewound

Power Rating

300 W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300 W

Depth

73 mm

Military Standard

Not

Lead/Base Style

Screw

Width

72.9996 mm

Height

45.0088 mm

Length

180 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No