GD25Q16CTIGR

GigaDevice Semiconductor (HK) Limited GD25Q16CTIGR

Part No:

GD25Q16CTIGR

Package:

8-SOIC (0.154, 3.90mm Width)

ROHS:

AINNX NO:

1741766-GD25Q16CTIGR

Category:

Memory

Description:

NOR FLASH

Products specifications
  • Factory Lead Time
    4 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Voltage - Supply
    2.7V~3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    16Mb 2M x 8
  • Clock Frequency
    120MHz
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Quad I/O
  • Write Cycle Time - Word, Page
    50μs, 2.4ms
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining
Documents & Media Download datasheets and manufacturer documentation for GigaDevice Semiconductor (HK) Limited GD25Q16CTIGR.