GeneSiC Semiconductor GBPC35010W

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

4

RoHS

Details

Mounting Styles

Through Hole

Factory Pack QuantityFactory Pack Quantity

500

Package Description

S-PUFM-W4

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Operating Temperature-Max

150 °C

Manufacturer Part Number

GBPC35010W

Package Shape

SQUARE

Number of Elements

4

Part Life Cycle Code

Active

Ihs Manufacturer

LITE-ON SEMICONDUCTOR CORP

Risk Rank

5.75

Series

GBPC35

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL RECOGNIZED

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Reach Compliance Code

compliant

Termination Style

Solder Lead

JESD-30 Code

S-PUFM-W4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

BRIDGE RECTIFIER DIODE

Output Current-Max

35 A

Number of Phases

1

Rep Pk Reverse Voltage-Max

1000 V

Non-rep Pk Forward Current-Max

400 A

Breakdown Voltage-Min

1000 V