GeneSiC Semiconductor GB02SHT06-46

Factory Lead Time

18 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-206AB, TO-46-3 Metal Can

Number of Pins

3

Number of Elements

1

Operating Temperature (Max.)

210°C

Power Dissipation (Max)

64W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2014

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Applications

EFFICIENCY

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

PD-CASE

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

O-MBCY-W2

Configuration

SINGLE

Speed

No Recovery Time > 500mA (Io)

Diode Type

Silicon Carbide Schottky

Current - Reverse Leakage @ Vr

5μA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.6V @ 1A

Operating Temperature - Junction

-55°C~225°C

Output Current-Max

4A

Current - Average Rectified (Io)

4A DC

Max Reverse Voltage (DC)

600V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

4A

Number of Phases

1

Reverse Recovery Time

0ns

Capacitance @ Vr, F

76pF @ 1V 1MHz

Non-rep Pk Forward Current-Max

10A

Reverse Current-Max

5μA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant