General Electric Solid State ICL8038BCJD

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Weight

0.4 kg

Number of Terminals

14

Analogue

POS40

Execution

tube

Melting temperature

183...240 °C

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Package Description

DIP, DIP14,.3

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

coil

ECCN Code

EAR99

Type

Soft solder tin-lead Sn/Pb with flux

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Reach Compliance Code

unknown

JESD-30 Code

R-XDIP-T14

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Analog IC - Other Type

WAVEFORM GENERATION

Diameter

0.8 mm