Future Designs Inc. DK-57VTS-LPC3250

Factory Lead Time

6 Weeks

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Published

2009

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Voltage - Supply

5V

Interface

I2C

Utilized IC / Part

LPC3250 ARM9

Supplied Contents

Board(s), Cable(s), Power Supply, Accessories

Evaluation Kit

Yes

Sensor Type

Touch Screen

Embedded

Yes, MCU, 16/32-Bit

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant