MB89R118C2-DIAP15-P1

FUJITSU Semiconductor Limited MB89R118C2-DIAP15-P1

Part No:

MB89R118C2-DIAP15-P1

Package:

-

AINNX NO:

69111768-MB89R118C2-DIAP15-P1

Description:

Description: SPECIALTY CONSUMER CIRCUIT

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    FUJITSU LTD
  • Package Description
    DIE,
  • Number of Words
    2048 words
  • Number of Words Code
    2000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -20 °C
  • Package Body Material
    UNSPECIFIED
  • Package Code
    DIE
  • Package Equivalence Code
    DIE OR CHIP
  • Package Shape
    UNSPECIFIED
  • Package Style
    UNCASED CHIP
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position
    UPPER
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Number of Functions
    1
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    X-XUUC-N
  • Organization
    2KX8
  • Memory Width
    8
  • Memory Density
    16384 bit
  • Memory IC Type
    FRAM-EMBEDDED
  • Endurance
    1000000000000 Write/Erase Cycles
  • Data Retention Time-Min
    10
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