FLM1213-4F
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68717037-FLM1213-4F
Description: RF Power Field-Effect Transistor, 1-Element, KU Band, Gallium Arsenide, N-Channel, Junction FET, HERMETIC SEALED, METAL CERAMIC PACKAGE-2
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
a count of all of the component leads (or pins)
An indicator of formal certification of qualifications.
In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.