MB9BF104NPMC-G-JNE1

Fujitsu Electronics America, Inc. MB9BF104NPMC-G-JNE1

Part No:

MB9BF104NPMC-G-JNE1

Datasheet:

MB9B100 Series

Package:

100-LQFP

ROHS:

AINNX NO:

4956367-MB9BF104NPMC-G-JNE1

Description:

IC MCU 32BIT 256KB FLASH 100LQFP

Products specifications
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    100-LQFP
  • Supplier Device Package
    100-LQFP (14x14)
  • Data Converters
    A/D 16x12b
  • Memory Types
    FLASH
  • Number of I/Os
    80
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    FM3 MB9B100
  • Published
    2011
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature
    -40°C
  • Frequency
    80MHz
  • Interface
    EBI/EMI, I2C, LIN, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    80MHz
  • RAM Size
    32K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V~5.5V
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    CSIO, EBI/EMI, I2C, LINbus, UART/USART
  • Core Architecture
    ARM
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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