Fujitsu Electronics America, Inc. MB85RS64TUPNF-G-JNE2

Package / Case

SOP-8

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Chip Density (bit)

64K

Density Range (bit)

1K to 256K

Data Bus Width (bit)

8

Max. Access Time (ns)

18

Process Technology

CMOS

Interface Type

Serial-SPI

Minimum Operating Supply Voltage (V)

1.8

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

0.8

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Extended

Mounting

Surface Mount

Package Height

1.4

Package Width

3.9

Package Length

5.05

PCB changed

8

Supplier Package

SOP

Moisture Sensitive

Yes

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

3.6 V

Unit Weight

0.002116 oz

Minimum Operating Temperature

- 55 C

Factory Pack QuantityFactory Pack Quantity

500

Supply Voltage-Min

1.8 V

Mounting Styles

SMD/SMT

Manufacturer

Fujitsu Semiconductor

Brand

Fujitsu Semiconductor

RoHS

Details

Package Description

SOP,

Package Style

SMALL OUTLINE

Number of Words Code

8000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

MB85RS64TUPNF-G-JNE2

Number of Words

8192 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

SOP

Package Shape

RECTANGULAR

Part Life Cycle Code

Active

Ihs Manufacturer

FUJITSU LTD

Risk Rank

5.56

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Subcategory

Memory & Data Storage

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

1.8 V to 3.6 V

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

1.8 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

64 kB

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

8Kx8

Seated Height-Max

1.75 mm

Memory Width

8

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

FRAM

Memory Density

65536 bit

Memory IC Type

MEMORY CIRCUIT

Product Category

a particular group of related products.

F-RAM

Width

3.9 mm

Length

5.05 mm